MicroBooNE Document 191-v1

Copper Clad Wire Thermal Contraction Stress and Shock Test

Document #:
MicroBooNE-doc-191-v1
Document type:
Design or Technical Note
Submitted by:
R Schmitt
Updated by:
R Schmitt
Document Created:
11 Nov 2008, 07:33
Contents Revised:
11 Nov 2008, 07:33
Metadata Revised:
11 Nov 2008, 07:33
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Abstract:
Copper clad stainless wire is being considered for wire planes. Steady state thermal contraction stress was calculated and found to be low. Samples of the wire were thermally shocked in liquid nitrogen and tested for damage to the cladding. None was found.
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