MicroBooNE Document 1804-v1

Thermal Stress for TPC Wires During Cooldown of Micro-Boone

Document #:
MicroBooNE-doc-1804-v1
Document type:
Design or Technical Note
Submitted by:
KC Wu
Updated by:
KC Wu
Document Created:
15 Dec 2011, 08:48
Contents Revised:
15 Dec 2011, 08:48
Metadata Revised:
15 Dec 2011, 13:05
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Abstract:
Thermal stress for TPC wires during cooldown of micro-boone is investigated. The thermal stress is found to be a "small" percentage of the yield stess of the 304V wire. With a 0.7 kg pre-tnesion, the wire will not be damaged with a control cooldown (20 K temperaure differnce for example) as long as the pre-tension is less than that given. Calculations for a few cooldown rates and pre-tension are given.
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